(1)‘Why can’t Samsung Electronics receive Dual TC bonder equipment, the core HBM equipment from Hanmi Semiconductor?’
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(2)Hynix and Micron use dual TC bonder equipment supplied by Hanmi Semiconductor, but Samsung Electronics has not yet received supply and uses equipment from other companies with poor performance.
(3)In 2017, Hanmi Semiconductor developed the world’s first dual TC bonder equipment, which has a throughput four times higher than that of existing TC bonders, and delivered it to Hynix.
(4)TC Bonder is a thermocompression bonding equipment that connects wafers to each other, enabling the construction of 2.5D and 3D semiconductors. This is a core equipment required for HBM production that implements conversational artificial intelligence (AI) ‘ChatGPT’.
(5)However, Samsung Electronics, the largest of the three semiconductor companies, is not receiving delivery of this core equipment.
(6)Why?
(7)Let’s go back in time to 2012.
(8)Hanmi Semiconductor filed four patent infringement lawsuits related to ‘sewing and placement’ used in semiconductor back-end processes against SECRON, a subsidiary of Samsung Electronics, and won.
(9)Developed by Hanmi Semiconductor, it has been supplying dozens of ‘Sewing and Placement’ units a year to Samsung Electronics since 2000, but the number of orders has plummeted since 2007, and only one unit has been delivered between 2008 and 2012.
(10)During this period, Secron, a subsidiary of Samsung Electronics, delivered as many as 158 units of ‘sewing and placement’ equipment.
(11)The problem is that if you only deal with Samsung Electronics, it is a subsidiary.
(12)How can Hanmi Semiconductor turn a blind eye, but Secron is encroaching on Hanmi Semiconductor’s clients in the global market?
(13)Samsung infringed on Hanmi Semiconductor’s patents through its subsidiary.
(14)As the production of the product threatened the survival of Hanmi Semiconductor, Hanmi Semiconductor filed a patent lawsuit and ultimately won.
(15)Small and medium-sized businesses are a long-standing problem among large corporations in Korea.
(16)It was an incident that clearly demonstrated technology theft.
(17)After this incident, the transaction between Hanmi Semiconductor and Samsung
(18)Samsung has been in contact with Hanmi Semiconductor, which has recently taken a dominant position in the HBM equipment market, through various channels to receive equipment supplies, and is making unsolicited comments.
(19)Hanmi Semiconductor dismissed the claim as unfounded and not in discussion.
(20)Samsung Electronics, the superpower in the semiconductor market, has HBM
(21)In the market, the position has changed to ‘B’.
(22)This is all thanks to Jaeyong Lee.
(23)[Exclusive] Hanmi Semiconductor discusses exclusive supply of HBM core TC bonder to Samsung Electronics
(24)8 Reporter Pilho Yoon ② Entered 2023.12.28 14:56 ⑨ Modified 2023.12.28 16:52 ▪ Comment 2
(25)TC BONDER GRIFFIN first equipment shipped
(26)HANH Hanmi Semiconductor
(27)Hanmi Semiconductor’s ‘Dual TC Bonder Griffin Equipment Delivery Ceremony (Photo = Provided by Hanmi Semiconductor)
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